Semiconductor, or IC wafer fabrication, is the front-end phase of semiconductor manufacturing where the many intricate steps introduce numerous points at which contaminations and chemicals impurities pose catastrophic risks to the semiconductor’s reliability and quality. Controlling trace metal and organic contaminates with ultra-clean processes is critical in each device fabrication step to ensure the quality and purity of the materials, gases, and fine chemicals used in manufacturing.

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As personal technologies like smartphones, tablets, wearables, and the Internet of Things (IoT) devices become smaller and smaller, the highly integrated components within the devices need to become more and more complex. Quality assurance, quality control and failure testing are critical to the back-end phases of semiconductor and device manufacturing, because the sooner a defect can be identified and characterized, the faster production should re-start.

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Semiconductor, or IC packaging assembly, is an essential and complex back end phase of the semiconductor and electronic device design and manufacturing process. Contaminates introduced to wafer fabrication, component level packaging, module assembly, housing, and plastic components all affect the performance and ultimately the cost of the product. Like many other phases of semiconductor manufacturing, precise analytical sample testing is required to ensure the composition and quality of the assembly and packaging starting materials which are so critical to final device quality.

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